A novel residual stress test structure for MEMs thin films

Residual stress has a great impact on the feature of MEMS thin films, and the structural parameter and manufacturing process of MEMS thin films determine the magnitude of residual stress. Based on the conventional single-cantilever-beam micro-rotating structure, this paper presents a new structure and optimizes the corresponding parameters. The ANSYS software is adopted to conduct finite element analysis. In addition, we figure out the relationship between the new structure´s residual stress and the deflection angle according to elasticity formulas and geometric principles. The analysis demonstrates that the original structure has several advantages in aspects of measuring residual stress such as low deviation, high accuracy and simplified process.