• DocumentCode
    242468
  • Title

    Failure analysis of a bipolar integrated circuit

  • Author

    Sheng Xing ; Peng Kewu ; Zhang Zhengyuan ; Liu Luncai ; Liu Fan ; Wu Lina

  • Author_Institution
    Sichuan Inst. of Solid-State Circuits, Chongqing, China
  • fYear
    2014
  • fDate
    28-31 Oct. 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The research of failure analysis for integrated circuits can improve the reliability. Based on one failed circuit, do the analysis which including electrical parameter test, chip surface check, schematic diagram and layout analysis, and find the failure reason, then use simulation to verify the analized conclusion. Finally, throw out some effective ways to avoid this kind of failure that might happen again, which is helpful for improving the reliability of integrated circuits.
  • Keywords
    bipolar integrated circuits; failure analysis; integrated circuit layout; integrated circuit reliability; integrated circuit testing; bipolar integrated circuit; chip surface check; eletrical parameter testing; failure analysis; layout analysis; reliability; schematic diagram; Abstracts; Electron tubes; Gain; Integrated circuit reliability; Pins; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4799-3296-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2014.7021658
  • Filename
    7021658