DocumentCode
242468
Title
Failure analysis of a bipolar integrated circuit
Author
Sheng Xing ; Peng Kewu ; Zhang Zhengyuan ; Liu Luncai ; Liu Fan ; Wu Lina
Author_Institution
Sichuan Inst. of Solid-State Circuits, Chongqing, China
fYear
2014
fDate
28-31 Oct. 2014
Firstpage
1
Lastpage
3
Abstract
The research of failure analysis for integrated circuits can improve the reliability. Based on one failed circuit, do the analysis which including electrical parameter test, chip surface check, schematic diagram and layout analysis, and find the failure reason, then use simulation to verify the analized conclusion. Finally, throw out some effective ways to avoid this kind of failure that might happen again, which is helpful for improving the reliability of integrated circuits.
Keywords
bipolar integrated circuits; failure analysis; integrated circuit layout; integrated circuit reliability; integrated circuit testing; bipolar integrated circuit; chip surface check; eletrical parameter testing; failure analysis; layout analysis; reliability; schematic diagram; Abstracts; Electron tubes; Gain; Integrated circuit reliability; Pins; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4799-3296-2
Type
conf
DOI
10.1109/ICSICT.2014.7021658
Filename
7021658
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