DocumentCode
2425162
Title
RF MEMS filter based on one step of copper electroplating
Author
Liu, Yu ; Li, Xiuhan ; Fang, Dongming ; Zhang, Haixia
Author_Institution
MEMS Res. Center, Peking Univ., Beijing, China
fYear
2010
fDate
20-23 Jan. 2010
Firstpage
945
Lastpage
949
Abstract
A MEMS RF Filter on glass substrate has been designed, simulated, fabricated and tested. The fabrication process has been developed based on copper electroplating, which is compatible with the copper inductor fabrication process, so it can be integrated into LC filter. Finally, spiral capacitors with different dimensions and LC filters have been fabricated successfully. Then a detailed analysis of the frequency response of the filters is presented according to the test result from network analyzer.
Keywords
copper; electroplating; micromechanical devices; radiofrequency filters; Cu; LC filter; RF MEMS filter; electroplating; glass substrate; inductor fabrication process; network analyzer; spiral capacitors; HFSS; MEMS RF Filter; copper electroplating;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location
Xiamen
Print_ISBN
978-1-4244-6543-9
Type
conf
DOI
10.1109/NEMS.2010.5592111
Filename
5592111
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