DocumentCode
2425494
Title
Electrodeposition of CoNiMnP-based permanent magnetic film
Author
Quan Yuan ; Fang, Dong-Ming ; Li, Xiuhan ; Zhang, Hai-Xia
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing, China
fYear
2010
fDate
20-23 Jan. 2010
Firstpage
883
Lastpage
886
Abstract
This paper presents the fabrication process and the properties of the CoNiMnP-based permanent magnetic film fabricated with electrodeposition technique. The CoNiMnP magnetic film was fabricated on silicon substrate using MEMS compatible micromachining process. The film consists of magnet array with 5mm×5mm square cells with the thickness of 12μm and 20μm. And some specific methods were used in the deposition process to improve the magnetic properties of the magnetic film, such as 5000Gs external magnetic fields provided by two magnets as well as the pulse current with density of 8mA/cm2. The results showed that the characterization of CoNiMnP-based permanent magnetic film was improved. For 20μm electroplated magnetic film, the coercivity of vertical plane is 1200Oe with the retentivity is 0.12Teslas, and the energy density is 3.24kJ/m3. This permanent magnetic film has high vertical anisotropy and high energy density and it can be used for realizing magnetic MEMS device.
Keywords
cobalt alloys; current density; electroplating; magnetic anisotropy; magnetic thin films; manganese alloys; micromachining; micromechanical devices; nickel alloys; permanent magnets; phosphorus alloys; CoNiMnP; MEMS compatible micromachining processing; Si; coercivity; electrodeposition technique; electroplated magnetic film; external magnetic field; high energy density; permanent magnetic film; pulse current density; silicon substrate; size 12 mum; size 20 mum; vertical anisotropy; vertical plane; CoNiMnP; Electrodeposition; Hysteresis loops; Permanent film;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location
Xiamen
Print_ISBN
978-1-4244-6543-9
Type
conf
DOI
10.1109/NEMS.2010.5592126
Filename
5592126
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