• DocumentCode
    2425494
  • Title

    Electrodeposition of CoNiMnP-based permanent magnetic film

  • Author

    Quan Yuan ; Fang, Dong-Ming ; Li, Xiuhan ; Zhang, Hai-Xia

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2010
  • fDate
    20-23 Jan. 2010
  • Firstpage
    883
  • Lastpage
    886
  • Abstract
    This paper presents the fabrication process and the properties of the CoNiMnP-based permanent magnetic film fabricated with electrodeposition technique. The CoNiMnP magnetic film was fabricated on silicon substrate using MEMS compatible micromachining process. The film consists of magnet array with 5mm×5mm square cells with the thickness of 12μm and 20μm. And some specific methods were used in the deposition process to improve the magnetic properties of the magnetic film, such as 5000Gs external magnetic fields provided by two magnets as well as the pulse current with density of 8mA/cm2. The results showed that the characterization of CoNiMnP-based permanent magnetic film was improved. For 20μm electroplated magnetic film, the coercivity of vertical plane is 1200Oe with the retentivity is 0.12Teslas, and the energy density is 3.24kJ/m3. This permanent magnetic film has high vertical anisotropy and high energy density and it can be used for realizing magnetic MEMS device.
  • Keywords
    cobalt alloys; current density; electroplating; magnetic anisotropy; magnetic thin films; manganese alloys; micromachining; micromechanical devices; nickel alloys; permanent magnets; phosphorus alloys; CoNiMnP; MEMS compatible micromachining processing; Si; coercivity; electrodeposition technique; electroplated magnetic film; external magnetic field; high energy density; permanent magnetic film; pulse current density; silicon substrate; size 12 mum; size 20 mum; vertical anisotropy; vertical plane; CoNiMnP; Electrodeposition; Hysteresis loops; Permanent film;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-6543-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2010.5592126
  • Filename
    5592126