• DocumentCode
    2425724
  • Title

    Fabrication of dome-shaped flexible electrode arrays for retinal prostheses

  • Author

    Sun, Xiaona ; Li, Gang ; Zhu, Zhuanghui ; Zhou, Hongbo ; Zhao, Jianlong

  • Author_Institution
    Nanotechnol. Lab., Chinese Acad. of Sci., Shanghai, China
  • fYear
    2010
  • fDate
    20-23 Jan. 2010
  • Firstpage
    48
  • Lastpage
    51
  • Abstract
    In order to enable electrode sites to get closer to target neurons, obtain a better stimulation and minimize the electrochemical erosion of electrode, we proposed dome-shaped flexible neural microelectrode arrays (MEAs) for neural applications. With the use of photosensitive polyimide (Durimide 7510, PI) as substrate, a flexible microelectrode with 6 × 6 array of dome-shaped electrode sites was fabricated by combining photolithography and metal patterning with electroplating process. An evaluation of the dome-shaped electrode was also performed by simulation, SEM and impedance test. Experimental results showed, compared with conventional planar microelectrodes with the same base area, the 3D dome-shaped microelectrodes exhibited an 80% decrease in electrode impedance. The dome-shaped electrodes produce more uniform current distribution than the 3D pyramid-shaped microelectrode, which is helpful for its long-term safety of stimulation.
  • Keywords
    bioMEMS; biomedical electrodes; biomedical materials; electroplating; eye; microelectrodes; neurophysiology; photolithography; polymers; prosthetics; Durimide 7510 substrate; SEM; dome shaped flexible microelectrode arrays; dome shaped flexible neural MEA; electrode electrochemical erosion; electroplating; impedance test; metal patterning; neural applications; photolithography; photosensitive polyimide; retinal prostheses; target neurons; Electroplating dome-shaped structures; flexible substrate; microelectrode; neural stimulation; retinal Prostheses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-6543-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2010.5592137
  • Filename
    5592137