• DocumentCode
    2426025
  • Title

    A low-noise low-power amplifier for implantable device for neural signal acquisition

  • Author

    Li, Ming-Ze ; Tang, Kea-Tiong

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    3806
  • Lastpage
    3809
  • Abstract
    This paper presents a low-noise low-power amplifier for implantable device for neural signal acquisition. By operating MOS transistors in the subthreshold region, smaller low-frequency noise and lower power consumption can be achieved. A low power, low-noise common-drain buffer and a low-noise, high-linearity, low pass filter are used for high frequency noise filtering. Post-layout simulation shows the input referred noise of the system is 2.19 muVrms from 10 Hz to 10 KHz, power consumption is 55.8 muW, and the NEF is 2.53. The amplifier was fabricated using a T SMC 0.18 mum 1P6M CMOS process. Simulation results show that this low-noise, low-power amplifier is suitable for implantable device applications.
  • Keywords
    MOSFET; biomedical electronics; biomedical equipment; low noise amplifiers; low-pass filters; medical signal detection; neurophysiology; prosthetics; CMOS process; MOS transistors; common-drain buffer; frequency 10 Hz to 10 kHz; high frequency noise filtering; implantable device; low pass filter; low-frequency noise; low-noise low-power amplifier; neural signal acquisition; post-layout simulation; power consumption; Action Potentials; Amplifiers, Electronic; Biomedical Engineering; Computer Simulation; Computers; Electrodes, Implanted; Electronics, Medical; Electrophysiology; Equipment Design; Humans; Neurons; Signal Processing, Computer-Assisted; Transducers; Transistors, Electronic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5335204
  • Filename
    5335204