• DocumentCode
    2426363
  • Title

    Pin-joint design effect on the reliability of a polysilicon microengine

  • Author

    Tanner, Danelle M. ; Walraven, Jeremy A. ; Mani, Seethambal S. ; Swanson, Scot E.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    122
  • Lastpage
    129
  • Abstract
    Accelerated stress experiments were performed on a class of pin joints to determine reliability. We varied parameters that affected the area of the rubbing surfaces and the gap between those surfaces. Most of the pin joints failed due to seizure. We observed bimodal failure distributions where the lower distribution was associated with an adhesion event with no observable wear debris. The upper distribution of failures was associated with agglomerations of wear debris, which may have seized the pin joint. The effect of surface coatings was also studied. We found that for supercritical carbon dioxide (SCCO2) dried microengines; the largest effect was due to gap spacing. For microengines with a self-assembled monolayer coating (SAMS), we observed minimal difference in the lifetimes of failed devices.
  • Keywords
    adhesion; drying; elemental semiconductors; failure analysis; micromechanical devices; monolayers; self-assembly; semiconductor device reliability; silicon; wear; CO2; MEMS; Si; accelerated stress; adhesion; bimodal failure distribution; pin-joint design; polysilicon microengine; reliability; rubbing surface; seizure; self-assembled monolayer coating; supercritical carbon dioxide drying; surface coating; wear debris; Acceleration; Adhesives; Coatings; Failure analysis; Gears; Hydraulic actuators; Laboratories; Microelectromechanical systems; Micromechanical devices; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2002. 40th Annual
  • Print_ISBN
    0-7803-7352-9
  • Type

    conf

  • DOI
    10.1109/RELPHY.2002.996623
  • Filename
    996623