Title :
Accelerated reliability - thermal and mechanical fatigue solder joints methodologies
Author :
Strifas, Nick ; Vaughan, Chris ; Ruzzene, Massimo
Abstract :
A generalized finite element based approach for estimating the reliability of solder joint for surface mount packages is presented in this study. The methodology is based on the viscoplastic constitutive law for the solder response and the crack growth rate model for solder joint fatigue. An accelerated life prediction model is developed for eutectic Sn-Pb solder joints assuming a two-parameter Weibull failure distribution.
Keywords :
Weibull distribution; circuit reliability; failure analysis; fatigue; finite element analysis; life testing; surface mount technology; viscoplasticity; Sn-Pb; accelerated life prediction model; accelerated reliability; crack growth rate model; finite element based approach; mechanical fatigue; solder joints; solder response; surface mount packages; thermal fatigue; two-parameter Weibull failure distribution; viscoplastic constitutive law; Acceleration; Assembly; Capacitive sensors; Circuit testing; Degradation; Fatigue; Life estimation; Soldering; Thermal resistance; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2002. 40th Annual
Print_ISBN :
0-7803-7352-9
DOI :
10.1109/RELPHY.2002.996627
