Thermal modeling of microelectronic equipment taking into account thermal contact conductance

Author

Fedasyuk, Dmytro

Author_Institution

CAD Dept., Lviv Polytech. Nat. Univ., Ukraine

fYear

2003

fDate

18-22 Feb. 2003

Firstpage

319

Lastpage

320

Abstract

This paper presents a practical approach that can be applied for the thermal simulation of the microelectronics devises taking into account thermal contact resistance. The method described makes it possible to use a combination of thermal-electrical analogy technique and analytical approaches to simulating the heat removal process in the IC packages and other structures.

Keywords

heat sinks; integrated circuit modelling; integrated circuit packaging; rough surfaces; temperature distribution; thermal management (packaging); thermal resistance; IC packages; conforming rough surfaces; contact pressure; heat removal; heat sinks; microelectronic equipment; temperature distribution; thermal contact conductance; thermal contact resistance; thermal simulation; thermal-electrical analogy technique; Contact resistance; Electronic packaging thermal management; Heat sinks; Microelectronics; Resistance heating; Rough surfaces; Surface resistance; Thermal conductivity; Thermal resistance; Trigeneration;

fLanguage

English

Publisher

ieee

Conference_Titel

CAD Systems in Microelectronics, 2003. CADSM 2003. Proceedings of the 7th International Conference. The Experience of Designing and Application of

Print_ISBN

966-553-278-2

Type

conf

DOI

10.1109/CADSM.2003.1255077

Filename

1255077