DocumentCode :
2426974
Title :
Optoelectronic interconnections for high throughput networks and pipeline signal processing
Author :
Sawchuk, A.A. ; Kuznia, C.B.
Author_Institution :
Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
fYear :
2000
fDate :
24-28 July 2000
Abstract :
We describe the concept and experimental implementation of a smart pixel (SP) system for networking and image/video processing based on digital optoelectronic (DO) technology. DO technology enables 2D optical data transfer to and from VLSI chips at throughputs of >1 Tb/s, with very low latency (<10 ns) and very high speed (>500 Mb/s) on each of many (>100) parallel data channels. This system concept is called Transpar-TR (Translucent Smart Pixel Array-Token-Ring). The Transpar-TR is configured as a photonic ring network that transfers digital data using three-dimensional optical parallel data packets (OPDPs). Similar to most packet based networking schemes on serial interconnect links, the OPDPs contain data payload and source/destination node address information. The data pipe between nodes consists of a 2D array of optical links each operating at on-chip clock rates. This data pipe between nodes is designed to accommodate the sum of all other smaller data pipes entering the network from individual nodes, thus this system is an example of a firehose architecture. Our goal is to demonstrate two features unique to SP systems: networking with 2D spatial parallel channels and 2D parallel pipeline image and video processing for applications such as compression and tracking.
Keywords :
access protocols; field programmable gate arrays; image processing equipment; integrated optoelectronics; optical computing; optical interconnections; packet switching; photonic switching systems; pipeline processing; reconfigurable architectures; smart pixels; telecommunication computing; token networks; very high speed integrated circuits; 2D array; 2D optical data transfer; 2D parallel pipeline processing; 2D spatial parallel channels; 3D optical parallel data packets; FPGA chip; Transpar-TR system; VLSI chips; digital optoelectronic technology; firehose architecture; high throughput networks; image compression; image processing; on-chip clock rates; optical links; optoelectronic interconnections; parallel data channels; photonic ring network; pipeline signal processing; reconfigurability; serial interconnect links; slotted token-ring protocol; smart pixel system; translucent smart pixel array-token-ring; very high speed; very low latency; video processing; Delay; High speed optical techniques; Optical arrays; Optical fiber communication; Optical fiber networks; Optical interconnections; Payloads; Smart pixels; Throughput; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic-Enhanced Optics, Optical Sensing in Semiconductor Manufacturing, Electro-Optics in Space, Broadband Optical Networks, 2000. Digest of the LEOS Summer Topical Meetings
Conference_Location :
Aventura, FL, USA
ISSN :
1099-4742
Print_ISBN :
0-7803-6252-7
Type :
conf
DOI :
10.1109/LEOSST.2000.869687
Filename :
869687
Link To Document :
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