Circuit boards with integrated optical interconnects-technology, modeling, and application examples

Author

Strake, E. ; Krabe, D.

Author_Institution

Robert Bosch GmbH, Hildesheim, Germany

fYear

2000

fDate

24-28 July 2000

Abstract

This contribution presents concepts, technologies, and first results for novel hybrid electrical/optical circuit boards which extend the conventional setup of existing electrical printed circuit boards by incorporating additional layers with optical waveguide structures. A major aspect of the inclusion of optically functional layers into conventional circuit boards is the requirement of maximum compatibility with existing board fabrication and assembly techniques. Any substantial change in board fabrication and assembly parameters has to be avoided in order to obtain the desired cost efficiency.

Keywords

optical backplanes; optical planar waveguides; printed circuit accessories; assembly techniques; board integrated optical interconnects; cost efficiency; hot embossing; hybrid electrical/optical circuit boards; integrated optical interconnects; maximum compatibility; modeling; multimedia optical bus systems; multimode waveguide; optical waveguide structures; optically functional layers; printed circuit boards; ray tracing; Integrated circuit technology; Optical device fabrication; Optical interconnections; Optical materials; Optical receivers; Optical refraction; Optical scattering; Optical variables control; Optical waveguides; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic-Enhanced Optics, Optical Sensing in Semiconductor Manufacturing, Electro-Optics in Space, Broadband Optical Networks, 2000. Digest of the LEOS Summer Topical Meetings

Conference_Location

Aventura, FL, USA

ISSN

1099-4742

Print_ISBN

0-7803-6252-7

Type

conf

DOI

10.1109/LEOSST.2000.869688

Filename

869688