DocumentCode :
2427050
Title :
Modeling of highly multimodal optical interconnects for time domain analysis
Author :
Himmler, A. ; Griese, Elmar ; Schrage, J. ; Bierhoff, T. ; Wallrabenstein, A.
Author_Institution :
Siemens AG, Paderborn, Germany
fYear :
2000
fDate :
24-28 July 2000
Abstract :
The integration of optical interconnects into electronic systems results in hybrid electrical-optical interconnects. To design such systems the physical behaviour of the electrical and optical parts has to be modeled. The latter one requires the consideration of the technological given facts typical for the addressed interconnection level (component-, module-, and system-level) in order to select appropriate numerical methods and simulation models. In case of guided wave optics the interconnection level characteristic dimensions determine whether the optical single-mode or multimode technology is applicable. An approach is described which enables the application of recursive convolution algorithms leading to very accurate results.
Keywords :
convolution; optical crosstalk; optical interconnections; optical waveguide theory; ray tracing; recursive estimation; time-domain analysis; guided wave optics; highly multimodal optical interconnects; hybrid electrical-optical interconnects; modelling; optical path; ray tracing; recursive convolution algorithms; simulation models; slab waveguide; time domain analysis; transfer functions; Geometrical optics; Integrated circuit interconnections; Optical design; Optical interconnections; Optical receivers; Optical sensors; Optical transmitters; Optical waveguides; Stimulated emission; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic-Enhanced Optics, Optical Sensing in Semiconductor Manufacturing, Electro-Optics in Space, Broadband Optical Networks, 2000. Digest of the LEOS Summer Topical Meetings
Conference_Location :
Aventura, FL, USA
ISSN :
1099-4742
Print_ISBN :
0-7803-6252-7
Type :
conf
DOI :
10.1109/LEOSST.2000.869691
Filename :
869691
Link To Document :
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