DocumentCode :
2427361
Title :
Single bunch intensity monitoring system using an improved wall current monitor
Author :
Moore, C.D. ; Crisp, J. ; Howard, D. ; Kerns, Q. ; Martin, P. ; McConnell, D. ; Michals, P. ; Payne, J. ; Tawzer, S. ; Webber, R.
Author_Institution :
Fermi Nat. Accel. Lab., Batavia, IL, USA
fYear :
1989
fDate :
20-23 Mar 1989
Firstpage :
1513
Abstract :
The length and intensity of individual beam bunches are important parameters in collider operations. A system for automatically measuring these parameters has been developed using a wall current monitor signal digitized by a 1 GHz sampling oscilloscope under microprocessor control. Bunch length and intensity are computed by the microprocessor and presented to the host computer. To verify the accuracy required, attention was given to the system´s calibration and frequency response. The system has been successfully used to monitor colliding beam operations at Fermilab. The current 5% accuracy in measuring single-bunch intensity demonstrates the excellent fidelity and bandwidth of the system. The design of a resistive wall monitor with 3 kHz to 6 GHz bandwidth and less than 1 dB amplitude variation is presented. Using a microwave absorber inside the vacuum chamber to reduce noise is discussed
Keywords :
calibration; frequency response; microcomputer applications; particle beam diagnostics; physics computing; 1 GHz; 3 kHz to 6 GHz; Fermilab; bandwidth; beam bunches; calibration; collider operations; frequency response; host computer; intensity monitoring system; microprocessor control; microwave absorber; resistive wall monitor; sampling oscilloscope; single-bunch intensity; vacuum chamber; wall current monitor; Automatic control; Bandwidth; Colliding beam devices; Computerized monitoring; Condition monitoring; Control systems; Current measurement; Microprocessors; Oscilloscopes; Sampling methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Particle Accelerator Conference, 1989. Accelerator Science and Technology., Proceedings of the 1989 IEEE
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/PAC.1989.73497
Filename :
73497
Link To Document :
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