DocumentCode
2427370
Title
A Generic Chip-to-World Fluidic Interconnect System for Microfluidic Devices
Author
Korivi, Naga S. ; Jiang, Li
Author_Institution
Dept. of Electr. & Comput. Eng., Louisiana State Univ., Baton Rouge, LA
fYear
2007
fDate
4-6 March 2007
Firstpage
176
Lastpage
180
Abstract
In the recent years, there has been considerable research interest in microfluidic devices which are based on the single or multiphase flow of liquids and gases through micro-scale channels or systems fabricated by micro-electromechanical systems (MEMS) technology. Due to their ability to perform complex, multiple tasks with biochemicals, such devices have many applications, especially in the biomedicine area and are expected to continue generating interest. However, due to the need for handling micro-scale flow of liquids and the diverse nature of microfluidic devices, some of the major challenges in their development are the establishment of chip-to-world fluidic interconnects and device packaging. This paper reports on the development of a generic fluidic interconnect methodology based on assembly and plugging-in of the components. This approach greatly simplifies the currently difficult task of implementing fluidic connections and provides an integration capability that facilitates the experimental development of microfluidic devices.
Keywords
microfluidics; packaging; MEMS technology; chip-to-world fluidic interconnect system; device packaging; liquid microscale flow; microelectromechanical systems; microfluidic devices; microfluidic packaging; microscale channel; multiphase flow; Assembly; Electronics packaging; Fluid flow; Fluidic microsystems; Gases; Integrated circuit interconnections; Integrated circuit packaging; Microelectromechanical systems; Microfluidics; Micromechanical devices; Fluidic Interconnects; Microfluidic Devices; Microfluidic Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
System Theory, 2007. SSST '07. Thirty-Ninth Southeastern Symposium on
Conference_Location
Macon, GA
ISSN
0094-2898
Print_ISBN
1-4244-1126-2
Electronic_ISBN
0094-2898
Type
conf
DOI
10.1109/SSST.2007.352343
Filename
4160829
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