DocumentCode :
2427655
Title :
An electro-thermal SU-8 cantilever micro actuator based on bimorph effect
Author :
Zhang, Xiaobo ; Wu, Yibo ; Miao, Xiaodan ; Zhang, Congchun ; Ding, Guifu
Author_Institution :
Nat. Key Lab. of Nano/Micro Fabrication Technol., Shanghai Jiaotong Univ., Shanghai, China
fYear :
2010
fDate :
20-23 Jan. 2010
Firstpage :
362
Lastpage :
365
Abstract :
An electro-thermal SU-8 cantilever micro actuator with large vertical motion at low voltage is presented in this paper. It is lower in voltage due to employing SU-8 as functional material because of its high coefficient of thermal expansion. A finite element simulation was utilized to determine the optimal parameter. Windows in the center of cantilever can reduce internal residual stress. And we also added a nickel matrix on surface of support base to enhance bonding force between supportive base and driving section. Then actuators were obtained through Micro Fabrication Technology. Finally the Scanning-electron microscope and WYKO NT1100 optical profiling system demonstrated that the electro-thermal actuator possesses a high quality cantilever. Its stiffness is relative large that is sufficient for application in Micro device proved by Bonding Tester. With applied voltage 0.5V the electro-thermal actuator can generate a vertical displacement of 42.9μm.
Keywords :
bonding processes; cantilevers; elasticity; finite element analysis; internal stresses; microactuators; microfabrication; nickel; scanning electron microscopy; thermal expansion; WYKO NT1100 optical profiling system; bimorph effect; bonding force; bonding tester; driving section; electrothermal SU-8 cantilever microactuator; finite element simulation; internal residual stress; microdevice; microfabrication technology; nickel matrix; scanning electron microscope; size 42.9 mum; supportive base; thermal expansion; vertical motion; Cantilever; Electro-thermal actuator; Low voltage; Micro Fabrication Technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4244-6543-9
Type :
conf
DOI :
10.1109/NEMS.2010.5592235
Filename :
5592235
Link To Document :
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