Title :
Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures using triangular meshes
Author :
Jandhyala, Vikram ; Wang, Yong ; Gope, Dipanjan ; Shi, Richard
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Abstract :
The partial-element-equivalent-circuit (PEEC) approach is an effective method to convert three-dimensional on-chip multiconductor structures to circuit-level descriptions. In this paper, a triangular-mesh-based PEEC approach is described, wherein the surfaces of arbitrarily-shaped conducting structures are represented by triangular mesh tesselations. A coupled EM-circuit formulation is obtained through the separation of the scalar, vector, and ohmic potential interactions between pairs of triangular edges-based basis functions. The overall approach can be interpreted as a SPICE-free, surface-only version of PEEC method and is especially useful for on-chip signal integrity analysis of systems-on-chip layout where components with irregular shapes are common.
Keywords :
circuit simulation; electromagnetic field theory; equivalent circuits; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; mesh generation; 3D on-chip multiconductor structures; SPICE-free surface-only PEEC method; arbitrarily-shaped conducting structures; circuit-level descriptions; coupled EM-circuit formulation; coupled electromagnetic-circuit simulation; irregular component shapes; ohmic potential interactions; on-chip signal integrity analysis; partial-element-equivalent-circuit method; scalar potential interactions; systems-on-chip layout; triangular edges-based basis functions; triangular mesh tesselations; triangular meshes; triangular-mesh-based PEEC approach; vector potential interactions; Coupling circuits; Crosstalk; Electromagnetic coupling; Integral equations; Integrated circuit interconnections; Moment methods; SPICE; Shape; Signal analysis; System-on-a-chip;
Conference_Titel :
Quality Electronic Design, 2002. Proceedings. International Symposium on
Print_ISBN :
0-7695-1561-4
DOI :
10.1109/ISQED.2002.996688