• DocumentCode
    2427973
  • Title

    Nanometer-scale flatness and reliability investigation of stress-compensated symmetrically-metallized monocrystalline-silicon multi-layer membranes

  • Author

    Sterner, Mikael ; Stemme, Göran ; Oberhammer, Joachim

  • Author_Institution
    Microsyst. Technol. Lab., KTH-R. Inst. of Technol., Stockholm, Sweden
  • fYear
    2010
  • fDate
    20-23 Jan. 2010
  • Firstpage
    959
  • Lastpage
    962
  • Abstract
    This paper demonstrates a very robust and fabrication-parameter insensitive concept of full stress compensation in metallized monocrystalline silicon membranes, by symmetrical metal deposition on both sides of a transfer-bonded silicon membrane, resulting in previously unmatched near-perfectly flat and high-reliability metal-coated membranes. Application examples are high-performance optical mirror devices and quasi-optical tuneable microwave surfaces. The influence of the thickness ratio between the metal films on the two membrane sides are investigated, demonstrating a controllable curvature range from -0.3 mm-1 to 0.1 mm-1 by varying the top to bottom metal thickness ratio from 0.38 to 3.5, using metal thicknesses from 200 nm to 800 nm, and achieving near-zero curvature down to 0.004 mm-1. Extensive reliability tests, up to 100 million cycles, showed no detectable change in curvature, no plastic deformation and good repeatability in analog-mode deflection (within 2.5 %), proving the robustness of this concept of metallized monocrystalline membranes.
  • Keywords
    coating techniques; membranes; metalworking; plastic deformation; stress effects; analog-mode deflection; full stress compensation; metallized monocrystalline membrane concept; monocrystalline-silicon multilayer membranes; nanometer-scale flatness; reliability tests; stress-compensated multilayer membranes; symmetrical metal deposition; symmetrically-metallized multilayer membranes; transfer-bonded silicon membrane;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-6543-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2010.5592249
  • Filename
    5592249