Title :
The packaging effect on high g accelerometer test
Author :
Shi, Yunbo ; Zhu, Zhengqiang ; Li, Ping ; Liu, Jun
Author_Institution :
Nat. Key Lab. for Electron. Meas. Technol., Taiyuan, China
Abstract :
To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by 150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.
Keywords :
accelerometers; ceramics; electronics packaging; microsensors; stainless steel; Hopkinson bar; antioverload ability; ceramic package structure; high g accelerometer test; high-g acceleration sensor packaging material; modal frequency; natural frequencies; packaging effect; resonant phenomenon; stainless steel; structural stability; High g acceleration sensor; Modal frequency; Sensor packaging;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4244-6543-9
DOI :
10.1109/NEMS.2010.5592255