Title :
Twenty Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Abstract :
The following topics are dealt with: electronics packaging characterization; system level analysis; die level thermal management; thermal interface materials characterization and uses; conduction and thermal spreading; developments in liquid cooling; advances in air cooling; and modeling and simulation of thermal management.
Keywords :
cooling; thermal management (packaging); air cooling; die level thermal management; electronics packaging; liquid cooling; system level analysis; thermal interface materials; thermal management modeling; thermal management simulation; thermal spreading;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
1-4244-09589-4
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2007.352398
