Title :
High-Level Packaging Options for Outdoor Remote Units
Author_Institution :
Flextronics Int., San Jose, CA
Abstract :
Thermal performance of three high-level packaging options for natural convection and radiation cooled outdoor remote units was investigated in this work. Analytical correlations were used to determine required number and size of the fins. Then, a computational fluid dynamic simulation tool was used to investigate detailed thermal performance of three packaging options with the limitation that they use same fin and base areas. It was shown that all three designs perform almost the same if solar load is applied on the unit. However, the cube design performs worse than the narrow-deep and wide-slim designs if no solar load is applied.
Keywords :
computational fluid dynamics; cooling; heat sinks; natural convection; thermal management (packaging); analytical correlations; computational fluid dynamic simulation tool; cube design; fins size; high-level packaging options; narrow-deep design; natural convection cooling; natural radiation cooling; outdoor remote units; solar load; thermal performance; wide-slim design; Base stations; Electronic packaging thermal management; Heat sinks; Heat transfer; Solar heating; Surface resistance; Thermal conductivity; Thermal expansion; Thermal loading; Thermal resistance; Thermal performance; natural convection; outdoor remote units; packaging; radiation;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
1-4244-09589-4
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2007.352387