Title :
Comparison of Test Methods for High Performance Thermal Interface Materials
Author :
Jarrett, R.N. ; Merritt, C.K. ; Ross, J.P. ; Hisert, J.
Author_Institution :
Indium Corp. of America, Clinton, NY
Abstract :
This paper relates the application of two of the methods for testing the thermal interface materials to the development and characterization of high performance materials. Particular strengths of different test methods provide a more complete understanding of TIM performance. In combination the tools provide effective development and improvement metrics. The limitations in resolution and repeatability are discussed.
Keywords :
materials testing; thermal management (packaging); ASTM D5470; TIM testing; thermal interface materials; thermal test vehicle; Clamps; Heat sinks; Materials testing; Resistance heating; Steady-state; Surface resistance; Temperature sensors; Thermal force; Thermal resistance; Vehicles; ASTM D5470; TIM testing; thermal test vehicle;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
1-4244-09589-4
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2007.352391
