DocumentCode
2428787
Title
Thermal Management of High Density Very Low Profile Memory Module
Author
Ran, Hongyu ; Mohammed, Ilyas
Author_Institution
Tessera, Inc., San Jose, CA
fYear
2007
fDate
18-22 March 2007
Firstpage
118
Lastpage
124
Abstract
Thermal analysis is conducted on high density memory modules with 4 stack DDR2 package. Two interconnect technologies, ball stack and micro contact, are compared. Due to the high power density and limited space, thermal management of the modules is challenging. Limitation of conventional air cooling is discussed, and innovative cooling schemes are demonstrated.
Keywords
random-access storage; thermal analysis; thermal management (packaging); ball stack; conventional air cooling; high density very low profile memory module; micro contact; thermal analysis; thermal management; Communication system control; Cooling; Memory management; Packaging; Random access memory; Space technology; Temperature; Thermal conductivity; Thermal management; Thermal resistance; DRAM; FB-DIMM; RDIMM; ball stack; micro contact;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
1-4244-09589-4
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2007.352410
Filename
4160898
Link To Document