• DocumentCode
    2429001
  • Title

    VC rating and quality metrics: why bother? [SoC]

  • Author

    Bricaud, Pierre

  • Author_Institution
    Mentor Graphics Corp., Sophia Antipolis, France
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    257
  • Lastpage
    260
  • Abstract
    System-on-a-chip (SoC) is the paramount challenge of the electronic industry for the next millennium. The semiconductor industry has delivered what we were expecting and what was predicted: silicon availability for over 10 million gates. The VSIA (Virtual Socket Initiative Alliance) has defined industry standards and data formats for SoC. The reuse methodology manual, first ´how-to-do´ book to create reusable IPs (intellectual properties) for SoC designs has been published. EDA tool providers understand the issues and are proposing new tools and solutions on a quarterly basis. The last stage needs to be run: consolidate the experience and know-how of VSIA and IP OpenMORE rating system into an industry adopted VC (virtual component) quality metrics, and then pursue to tackle the next challenges: formal system specifications and VC transfer infrastructure. The objective of this paper is to set the stage for the final step towards a VC quality metrics effort that the industry needs to adopt, and define the next achievable goals.
  • Keywords
    circuit CAD; industrial property; integrated circuit design; quality control; software tools; standards; EDA tool providers; OpenMORE rating system; SoC; SoC data formats; SoC industry standards; VC quality metrics; VC transfer infrastructure; VSIA; Virtual Socket Initiative Alliance; formal system specifications; intellectual property; reusable IP; reuse methodology manual; system-on-a-chip; Application specific integrated circuits; Consumer electronics; Design methodology; Electronics industry; Graphics; Guidelines; Publishing; Silicon; System-on-a-chip; Virtual colonoscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2002. Proceedings. International Symposium on
  • Print_ISBN
    0-7695-1561-4
  • Type

    conf

  • DOI
    10.1109/ISQED.2002.996745
  • Filename
    996745