DocumentCode :
2429001
Title :
VC rating and quality metrics: why bother? [SoC]
Author :
Bricaud, Pierre
Author_Institution :
Mentor Graphics Corp., Sophia Antipolis, France
fYear :
2002
fDate :
2002
Firstpage :
257
Lastpage :
260
Abstract :
System-on-a-chip (SoC) is the paramount challenge of the electronic industry for the next millennium. The semiconductor industry has delivered what we were expecting and what was predicted: silicon availability for over 10 million gates. The VSIA (Virtual Socket Initiative Alliance) has defined industry standards and data formats for SoC. The reuse methodology manual, first ´how-to-do´ book to create reusable IPs (intellectual properties) for SoC designs has been published. EDA tool providers understand the issues and are proposing new tools and solutions on a quarterly basis. The last stage needs to be run: consolidate the experience and know-how of VSIA and IP OpenMORE rating system into an industry adopted VC (virtual component) quality metrics, and then pursue to tackle the next challenges: formal system specifications and VC transfer infrastructure. The objective of this paper is to set the stage for the final step towards a VC quality metrics effort that the industry needs to adopt, and define the next achievable goals.
Keywords :
circuit CAD; industrial property; integrated circuit design; quality control; software tools; standards; EDA tool providers; OpenMORE rating system; SoC; SoC data formats; SoC industry standards; VC quality metrics; VC transfer infrastructure; VSIA; Virtual Socket Initiative Alliance; formal system specifications; intellectual property; reusable IP; reuse methodology manual; system-on-a-chip; Application specific integrated circuits; Consumer electronics; Design methodology; Electronics industry; Graphics; Guidelines; Publishing; Silicon; System-on-a-chip; Virtual colonoscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2002. Proceedings. International Symposium on
Print_ISBN :
0-7695-1561-4
Type :
conf
DOI :
10.1109/ISQED.2002.996745
Filename :
996745
Link To Document :
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