DELPHI Style Compact Modeling of Stacked Die Packages

Multi-die packages with vertical (stacked) arrangement became popular in many application fields, necessitating appropriate thermal measurement and modeling techniques. In this study we present our attempt to yield boundary condition independent models of stacked die packages that reflect phenomena experienced by measurements. In our approach we propose an extension of the DELPHI model topology (accounting for multiple junctions). We also tried to extract most of the input data for model generation directly from thermal transient measurement results by the application of structure functions and by using electronically variable thermal resistances applied as boundary conditions during tests.