• DocumentCode
    2429238
  • Title

    Accuracy Comparison of a Standard CFD Code for the Thermal Analysis of Non-Simple Geometries with Baseline Experiments

  • Author

    Lasance, Clemens J M ; Rindt, Camilo

  • Author_Institution
    Philips Res. Labs., Eindhoven
  • fYear
    2007
  • fDate
    18-22 March 2007
  • Firstpage
    255
  • Lastpage
    261
  • Abstract
    The aim of the research is to investigate the temperature prediction accuracy of computational fluid dynamics (CFD) analyses for relatively simple model geometries (consisting of more than one component) in a natural and a mixed convection environment. A two-step approach has been taken. First, a baseline set-up was built consisting of a heated cubic component inside a (Perspexreg) PMMA enclosure for which all material properties and boundary conditions are known with sufficient accuracy. This baseline experiment is conceived to ensure that the CFD code predicts the temperature and velocity fields with an accuracy better than say 3%. The second step was to add complexities one by one. Temperature predictions for mixed convection of two cubic components in a low-velocity channel have been investigated, as well as the influence of cables, grilles etc. In particular the accuracy of the heat transfer from a heated upstream to an unpowered downstream component has been attended. Smoke visualization and 3D PIV measurements have been used to qualitatively and quantitatively check the numerically obtained velocity fields.
  • Keywords
    computational fluid dynamics; natural convection; thermal analysis; thermal management (packaging); 3D PIV measurements; baseline experiments; computational fluid dynamics; heated cubic component; nonsimple geometries; smoke visualization; standard CFD code; temperature prediction accuracy; thermal analysis; Accuracy; Boundary conditions; Code standards; Computational fluid dynamics; Computational geometry; Heat transfer; Material properties; Predictive models; Solid modeling; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    1-4244-09589-4
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2007.352432
  • Filename
    4160920