DocumentCode :
2429238
Title :
Accuracy Comparison of a Standard CFD Code for the Thermal Analysis of Non-Simple Geometries with Baseline Experiments
Author :
Lasance, Clemens J M ; Rindt, Camilo
Author_Institution :
Philips Res. Labs., Eindhoven
fYear :
2007
fDate :
18-22 March 2007
Firstpage :
255
Lastpage :
261
Abstract :
The aim of the research is to investigate the temperature prediction accuracy of computational fluid dynamics (CFD) analyses for relatively simple model geometries (consisting of more than one component) in a natural and a mixed convection environment. A two-step approach has been taken. First, a baseline set-up was built consisting of a heated cubic component inside a (Perspexreg) PMMA enclosure for which all material properties and boundary conditions are known with sufficient accuracy. This baseline experiment is conceived to ensure that the CFD code predicts the temperature and velocity fields with an accuracy better than say 3%. The second step was to add complexities one by one. Temperature predictions for mixed convection of two cubic components in a low-velocity channel have been investigated, as well as the influence of cables, grilles etc. In particular the accuracy of the heat transfer from a heated upstream to an unpowered downstream component has been attended. Smoke visualization and 3D PIV measurements have been used to qualitatively and quantitatively check the numerically obtained velocity fields.
Keywords :
computational fluid dynamics; natural convection; thermal analysis; thermal management (packaging); 3D PIV measurements; baseline experiments; computational fluid dynamics; heated cubic component; nonsimple geometries; smoke visualization; standard CFD code; temperature prediction accuracy; thermal analysis; Accuracy; Boundary conditions; Code standards; Computational fluid dynamics; Computational geometry; Heat transfer; Material properties; Predictive models; Solid modeling; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
1-4244-09589-4
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/STHERM.2007.352432
Filename :
4160920
Link To Document :
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