• DocumentCode
    2429395
  • Title

    Waveguide packaging

  • Author

    Pearson, G.A. ; Devlin, L.M.

  • Author_Institution
    Plextek Ltd., Great Chesterford, UK
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    42401
  • Lastpage
    42407
  • Abstract
    This paper presents a review of waveguide packaging techniques and issues, with particular reference to the millimetre wave frequency range. The term waveguide package is used in this context to refer to a package, with one or more waveguide interfaces, containing active components. In addition to the waveguide interface to the package, waveguide modes within the package housing must be considered. Any housing or package can effectively be a waveguide provided it is large enough. In most instances RF packages are small enough that waveguide modes need not be considered. However, with the ever more common usage of the millimetre wave frequency range, the existence and control of waveguide modes within a package must usually be considered. Applications for the millimetre wave frequency range have driven the requirement to design fully integrated system packages which often include an antenna, millimetre wave components and baseband components. Interfaces between waveguide and active components, which are now predominantly planar circuits, are therefore also discussed
  • Keywords
    packaging; active components; baseband components; millimetre wave components; millimetre wave frequency range; package housing; planar circuits; waveguide interfaces; waveguide packaging techniques;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Packaging and Interconnects at Microwave and mm-Wave Frequencies (Ref. No. 2000/083) IEE Seminar
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:20000418
  • Filename
    869808