Abstract :
This paper reviews the current status of LTCC (Low Temperature Cofired Ceramic) technology and its application in RF modules. LTCC is an established packaging technology and is rapidly growing in terms of its availability and capability. It provides a high performance, high density, stable interconnect and offers the opportunity to embed a range of passive components. A number of modules have been developed and manufactured using LTCC and a receiver front end and an RF output stage are discussed
