Title :
Buried passive elements manufactured in LTCC
Author :
Rytivaara, Martti
Author_Institution :
Filtronic LK Oy, Finland
Abstract :
Electrical performance of LTCC buried 3D inductors and capacitors was tested. The circuits tested were multilayer wire patterns occupying eight layers of DuPont 951AX. The motivation of this study was to find out the available Q, C and L of LTCC buried lumped elements. The effect of shielding electrical ground on lumped element parasitics was of particular interest. A result to be pointed out is the inductor design rule for highest possible Q*L/size for the tested double helical inductor structure. Maximum measured Q for 6.0 nH inductor was 83. The corresponding size was 3.5×3.5×1.6 mm3
Keywords :
ceramic packaging; 3D capacitors; 3D inductors; DuPont 951AX; LTCC; buried lumped elements; buried passive elements; design rule; double helical inductor; lumped element parasitics; multilayer wire patterns; shielding;
Conference_Titel :
Packaging and Interconnects at Microwave and mm-Wave Frequencies (Ref. No. 2000/083) IEE Seminar
Conference_Location :
London
DOI :
10.1049/ic:20000422