A novel modular smart PIC technology platform for functional diversification

Author

Cai, Jun ; Szendrei, Larry ; Caron, David ; Park, Steven

Author_Institution

Fairchild Semicond., South Portland, ME, USA

fYear

2009

fDate

14-18 June 2009

Firstpage

196

Lastpage

199

Abstract

Toward great flexibility in making advanced analog interfaces, a novel modular smart PIC technology platform for functional diversification is proposed. This technology platform offers high voltage capability, high current level, very large variety of integrable components, and process modular flexibility thorough diversification or simplification according to the different product application needs. Masks can be added or subtracted based upon product design. A modular route creation system allows us to create the lowest cost process flow for the product needs. Applications of interest for the modular smart PIC technology we focus on ultra-portable, computing, consumer and communication.

Keywords

power integrated circuits; advanced analog interfaces; modular smart power integrated circuit technology; CMOS logic circuits; CMOS process; CMOS technology; Energy management; Isolation technology; Logic design; Logic devices; Product design; Thermal management; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices & IC's, 2009. ISPSD 2009. 21st International Symposium on

Conference_Location

Barcelona

ISSN

1943-653X

Print_ISBN

978-1-4244-3525-8

Electronic_ISBN

1943-653X

Type

conf

DOI

10.1109/ISPSD.2009.5158035

Filename

5158035