Title :
Effect of mechanical stress on LDMOSFETs: Dependence on orientation and gate bias
Author :
Aghoram, U. ; Liu, J. ; Chu, M. ; Koehler, A.D. ; Thompson, S.E. ; Sridhar, S. ; Wise, R. ; Pendharkar, S. ; Denison, M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
Abstract :
The effect of mechanical stress on the on-resistance and breakdown voltage of <100> and <110> channel n- and p-type lateral power MOSFETs is investigated. Linear drain current enhancement under uniaxial mechanical stress was measured. The experimentally extracted piezoresistance coefficients (pi-coefficient) were found to be in good agreement with the values predicted by the model. The largest strain induced mobility enhancement in lateral power devices occurs for the strained <100> channel N-laterally diffused MOSFET and <110> channel drain extended PMOSFET. This was determined from the measurement of high gate bias pi-coefficients, pi<100>=-20times10-11 Pa-1 and pi<110>=50times10-11 Pa-1, respectively. It was also shown that the effect of strain on the breakdown voltage in these devices is insignificant (~80 mV for 60 MPa).
Keywords :
power MOSFET; N-laterally diffused MOSFET; breakdown voltage; drain extended PMOSFET; gate bias; linear drain current enhancement; mechanical stress effect; on-resistance voltage; piezoresistance coefficients; Capacitive sensors; MOSFET circuits; Mechanical variables measurement; Piezoresistance; Power engineering and energy; Power engineering computing; Silicon; Stress measurement; Substrates; Voltage;
Conference_Titel :
Power Semiconductor Devices & IC's, 2009. ISPSD 2009. 21st International Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4244-3525-8
Electronic_ISBN :
1943-653X
DOI :
10.1109/ISPSD.2009.5158041