• DocumentCode
    2430038
  • Title

    Role of N2 ion implantation dose on hot carrier lifetime in deep submicron NMOS devices

  • Author

    Guarin, Fernando J. ; Rauch, S.E. ; La Rosa, Giuseppe ; Brelsford, Kevin

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    2000
  • fDate
    2000
  • Abstract
    The impact of N2 ion implantation (I/I) dose before gate oxide growth on Hot Carrier (HC) reliability of NMOSFETs is reported here. Improvements ranging from 20 to 30 times in HC lifetime were achieved by the introduction of sufficiently high N2 (I/I) doses. It was found that for NMOSFET´s the HC degradation correlates inversely to the initial interface state density introduced by the N2 I/I process. We believe that the increased initial interface state density and the reduced hot carrier degradation both stem from the reduced hydrogen concentration at the Si-SiO2 interface with increasing N2 dose
  • Keywords
    MOSFET; carrier lifetime; hot carriers; interface states; ion implantation; nitrogen; semiconductor device reliability; semiconductor-insulator boundaries; 0.18 micron; H concentration reduction; N2; N2 ion implantation dose; NMOSFETs; Si-SiO2; Si-SiO2 interface; deep submicron NMOS devices; drain current degradation; hot carrier degradation reduction; hot carrier lifetime; hot carrier reliability; initial interface state density; pre-gate oxide growth; Acceleration; CMOS technology; Degradation; Hot carriers; Interface states; Ion implantation; MOS devices; MOSFETs; Oxidation; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Devices, Circuits and Systems, 2000. Proceedings of the 2000 Third IEEE International Caracas Conference on
  • Conference_Location
    Cancun
  • Print_ISBN
    0-7803-5766-3
  • Type

    conf

  • DOI
    10.1109/ICCDCS.2000.869837
  • Filename
    869837