• DocumentCode
    2430060
  • Title

    Post-breakdown conduction in sub-5 nm gate oxides in MOS devices

  • Author

    Miranda, E. ; Suné, J.

  • Author_Institution
    Fac. de Ingenieria, Buenos Aires Univ., Argentina
  • fYear
    2000
  • fDate
    2000
  • Abstract
    We investigate the electron transport through broken down ultrathin (<5 nm) SiO2 films in metal-oxide-semiconductor structures. We present experimental and theoretical results which demonstrate that the conduction properties of such systems are essentially governed by the cross-sectional area of the constriction connecting gate and substrate. It is shown that the hard or catastrophic breakdown mode exhibits conductance plateaus of the order of the quantum unit G0=2e2/h (≃12.9 kΩ-1), as found in quantum point contacts. On the other hand, the soft breakdown mode depends exponentially on the applied bias and can be understood in terms of tunneling through the potential barrier associated with the lower electron transversal state at the narrowmost part of the constriction
  • Keywords
    MIS devices; MOSFET; dielectric thin films; semiconductor device breakdown; tunnelling; 5 nm; MOS devices; SiO2; applied bias; catastrophic breakdown mode; conduction properties; cross-sectional area; electron transport; gate oxides; gate/substrate connecting constriction; hard breakdown mode; lower electron transversal state; metal-oxide-semiconductor structures; post-breakdown conduction; potential barrier; soft breakdown mode; tunneling; ultrathin SiO2 films; Breakdown voltage; Degradation; Electric breakdown; Electrons; Energy states; Joining processes; Laboratories; Leakage current; MOS devices; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Devices, Circuits and Systems, 2000. Proceedings of the 2000 Third IEEE International Caracas Conference on
  • Conference_Location
    Cancun
  • Print_ISBN
    0-7803-5766-3
  • Type

    conf

  • DOI
    10.1109/ICCDCS.2000.869838
  • Filename
    869838