Title :
A thermal-aware superscalar microprocessor
Author :
Lim, Chee How ; Daasch, W. Robert ; Cai, George
Author_Institution :
Dept. of Electr. & Comput. Eng., Portland State Univ., OR, USA
Abstract :
A thermal-aware technique is proposed to minimize the performance impact when thermal/power control mechanism is triggered. This technique, called thermal-aware microprocessor (TAM), uses on-chip thermal sensors to detect hot-spots within the microprocessor die. There is a secondary pipeline within the core. It is architecturally simple with ultra low power implementation. This secondary pipeline has two main functions: 1. thermal relieve; 2. ultra low power implementation for certain mobile environment (such as any where any time email connect function). When temperature exceeds a given threshold, the core superscalar pipelines are clock-gated while a secondary in-order pipeline is engaged. Since the secondary pipeline consumes much less power, it will have a much lower temperature, and therefore, it will provide a temporary thermal relieve to the core pipelines when the thermal/power mechanism is triggered. This relief reduces energy loss due to leakage, prevents overheating to improve product reliability, and eases cost for thermal solutions. The TAM can also combine with other low power techniques such voltage scaling to achieve ultra low power.
Keywords :
integrated circuit design; integrated circuit packaging; integrated circuit reliability; low-power electronics; microprocessor chips; mobile computing; pipeline processing; temperature sensors; TAM; clock-gated; hot-spots; microprocessor die; mobile environment; on-chip thermal sensors; product reliability; secondary in-order pipeline; secondary pipeline; thermal-aware superscalar microprocessor; thermal/power control mechanism; voltage scaling; Clocks; Costs; Energy consumption; Energy loss; Frequency; Microprocessors; Operating systems; Pipelines; Power control; Temperature;
Conference_Titel :
Quality Electronic Design, 2002. Proceedings. International Symposium on
Print_ISBN :
0-7695-1561-4
DOI :
10.1109/ISQED.2002.996797