DocumentCode :
2431357
Title :
Silicon solar cells with chromium-copper contacts
Author :
Härkönen, J. ; Yli-Koski, M. ; Tuominen, E. ; Ezer, Y. ; Sinkkonen, J. ; Marjamaki, T. ; Kaitila, J.
Author_Institution :
Electron. Phys. Lab., Helsinki Univ. of Technol., Espoo, Finland
fYear :
1997
fDate :
29 Sep-3 Oct 1997
Firstpage :
163
Lastpage :
165
Abstract :
The authors have applied front contact metallization of chromium and copper for the processing of cost-efficient crystalline silicon solar cells. This metallization method is previously known from integrated circuit technology and its advantages are widely known: chromium has excellent adhesion properties to silicon; copper is more than twice as conductive as the bulk aluminum; and both the metals are cheap. Nevertheless, so far, chromium-copper metallization has not been applied for commercial solar cell manufacturing which might be because copper is known to affect, destructively, the charge carrier lifetimes in silicon. In this paper, the authors present the metallization process and discuss the advantages of chromium-copper metallization in the scope of fabrication of cost-efficient silicon solar cells. They have studied the essential question of the diffusion of copper into silicon diffusion parameters from the responses using a mathematical method developed in their laboratory
Keywords :
chromium alloys; copper alloys; elemental semiconductors; metallisation; semiconductor device manufacture; semiconductor device models; semiconductor device testing; semiconductor-metal boundaries; silicon; solar cells; Cr-Cu; Cr-Cu contacts; Si; Si solar cells; adhesion properties; charge carrier lifetime; commercial solar cell manufacturing; diffusion parameters; front contact metallization; mathematical modelling; Adhesives; Aluminum; Chromium; Copper; Crystallization; Integrated circuit metallization; Integrated circuit technology; Manufacturing; Photovoltaic cells; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 1997., Conference Record of the Twenty-Sixth IEEE
Conference_Location :
Anaheim, CA
ISSN :
0160-8371
Print_ISBN :
0-7803-3767-0
Type :
conf
DOI :
10.1109/PVSC.1997.654054
Filename :
654054
Link To Document :
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