Development of a Single-chip Power Amplifier with Transmission Line Based Impedance Matching Circuit

Author

Kanaya, Haruichi ; Kim, Sangtae ; Pokharel, Ramesh K. ; Yoshida, Keiji

Author_Institution

Dept. of Electron., Kyushu Univ., Fukuoka

fYear

2006

fDate

4-5 Dec. 2006

Firstpage

1

Lastpage

4

Abstract

We designed a SiGe BiCMOS 5 GHz-band power amplifier (PA) by using the commercial electromagnetic (EM) and SPICE co-simulator. A new matching circuit composed of conductor-backed coplanar waveguide (CPW) meanderline resonator and impedance inverter is designed. Finally, we designed the 5 GHz PA with CPW matching circuit, spiral inductor, feed line and inductance of the bonding wires by using EM and SPICE co-simulator.

Keywords

BiCMOS integrated circuits; Ge-Si alloys; MMIC power amplifiers; coplanar waveguide components; impedance matching; inductors; invertors; resonators; transmission lines; 5 GHz; BiCMOS power amplifier; CPW matching circuit; SPICE co-simulator; SiGe; bonding wires; conductor-backed coplanar waveguide meanderline resonator; electromagnetic simulator; feed line; impedance inverter; impedance matching circuit; single-chip power amplifier; spiral inductor; transmission line; BiCMOS integrated circuits; Coplanar transmission lines; Coplanar waveguides; Distributed parameter circuits; Germanium silicon alloys; Impedance matching; Power amplifiers; Power transmission lines; SPICE; Silicon germanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless and Microwave Technology Conference, 2006. WAMICON '06. IEEE Annual

Conference_Location

Clearwater Beach, FL

Print_ISBN

1-4244-0849-0

Electronic_ISBN

1-4244-0849-0

Type

conf

DOI

10.1109/WAMICON.2006.351954

Filename

4161116