Title :
Rewired retiming for free flip-flop reductions without delay penalty
Author :
Jiang, Mingqi ; Tang, Wai-Chung ; Young, Evangeline F Y ; Wu, Y.L.
Author_Institution :
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Hong Kong, China
Abstract :
Due to the intrinsic difference between fan-in and fan-out counts of a retimed component, the number of flip-flops tends to be undesirably increased in a conventional retiming procedure, which can cause a significant area/power penalty on the retimed circuit. Nonetheless, because of the higher dominance on interconnect delays, without a mechanism to reflect real physical design accurately, the clock period produced by a retiming scheme will be unrealistic. To overcome these two major drawbacks of the conventional retiming technique, we propose a novel retiming flow combined with rewiring, being able to largely cut down flip-flops (FFs) while with the original retimed clock period uncompromised. For a more accurate delay estimation, all interconnect delays are formulated and calculated based on real placements. Experimental results show that this novel rewired retiming scheme can bring a reduction of 18.7% (on average) on the number of flip-flops compared to the original retiming without rewiring. This large FF reduction can be considered a free gain as the retimed clock period can still be kept without compromise in such flow. Further experiments have indicated that about 8.26% of the total dynamic power can be saved.
Keywords :
circuit optimisation; integrated circuit design; integrated circuit interconnections; logic design; free flip-flop reduction; interconnect delays; retimed clock; retiming flow; rewired retiming method; Clocks; Computer science; Delay estimation; Flip-flops; Integrated circuit interconnections; Logic gates; Power engineering and energy; Sequential circuits; Very large scale integration; Wire;
Conference_Titel :
VLSI Design, Automation and Test, 2009. VLSI-DAT '09. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4244-2781-9
Electronic_ISBN :
978-1-4244-2782-6
DOI :
10.1109/VDAT.2009.5158123