• DocumentCode
    2431897
  • Title

    Influence of post-deposition annealing on metal-organic decomposed lanthanum cerium oxide film

  • Author

    Lim, Way Foong ; Lockman, Zainovia ; Cheong, Kuan Yew

  • Author_Institution
    Energy Efficient & Sustainable Semicond. Res. Group, Univ. Sains Malaysia, Nibong Tebal, Malaysia
  • fYear
    2011
  • fDate
    28-30 Sept. 2011
  • Firstpage
    24
  • Lastpage
    27
  • Abstract
    Effects of post-deposition annealing was performed at different annealing temperatures (600, 800, and 1000°C) onto metal-organic decomposed lanthanum cerium oxide film spin-coated on Si substrate. X-ray diffraction analysis had detected four diffraction peaks of lanthanum cerium oxide in all of the investigated samples. Additional peak associated to lanthanum silicate (La2Si2O7) was detected in sample annealed at 1000°C. Electrical properties of the samples were investigated and it was found that sample annealed at 1000°C demonstrated the best metal-oxide-semiconductor characteristics in terms of giving the highest breakdown voltage and lowest leakage current density. Detailed explanation regarding this acquisition was discussed.
  • Keywords
    X-ray diffraction; annealing; cerium compounds; current density; electric properties; lanthanum compounds; leakage currents; organometallic compounds; Si; X-ray diffraction analysis; breakdown voltage; electrical property; low leakage current density; metal-organic decomposed lanthanum cerium oxide film; metal-oxide-semiconductor characteristics; post-deposition annealing; temperature 1000 degC; temperature 600 degC; temperature 800 degC; Annealing; Cerium; Films; Lanthanum; Logic gates; Silicon; X-ray diffraction; breakdown voltage; lanthanum cerium oxide; leakage current; metal-organic decomposition; post-deposition annealing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro and Nanoelectronics (RSM), 2011 IEEE Regional Symposium on
  • Conference_Location
    Kota Kinabalu
  • Print_ISBN
    978-1-61284-844-0
  • Type

    conf

  • DOI
    10.1109/RSM.2011.6088283
  • Filename
    6088283