DocumentCode :
2432738
Title :
Segment based X-Filling for low power and high defect coverage
Author :
Chen, Zhen ; Xiang, Dong ; Yin, Boxue
Author_Institution :
Dept. of Com. Sci. & Tech., Tsinghua Univ., Beijing, China
fYear :
2009
fDate :
28-30 April 2009
Firstpage :
319
Lastpage :
322
Abstract :
Many X-Filling strategies are proposed to reduce test power during scan based testing. Because their main motivation is to reduce the switching activities of test patterns in the test process, some of them are prone to reduce the test ability of test patterns, which may lead to low defect coverage. In this paper, we propose a segment based X-filling(SBF) technique to reduce test power using multiple scan chains, with minimal impact on defect coverage. Different from the previous filling methods, our X-filling technique is segment based and defect coverage aware. The method can be easily incorporated into traditional ATPG flow to keep capture power below a certain limit and keep the defect coverage at a high level.
Keywords :
program testing; defect coverage; multiple scan chains; scan based testing; segment based X-filling; test patterns; test power; test process; Automatic test pattern generation; Circuit faults; Circuit testing; Clocks; Costs; Filling; Flip-flops; Packaging; Power dissipation; Software testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, Automation and Test, 2009. VLSI-DAT '09. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4244-2781-9
Electronic_ISBN :
978-1-4244-2782-6
Type :
conf
DOI :
10.1109/VDAT.2009.5158159
Filename :
5158159
Link To Document :
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