DocumentCode :
2433249
Title :
Effect of the metal on metal/polymer contacts
Author :
Suh, Kwang-Suck ; Tanaka, John ; Damon, Dwight
Author_Institution :
Electr. Insulation Res. Center, Connecticut Univ., Storrs, CT, USA
fYear :
1988
fDate :
5-8 June 1988
Firstpage :
64
Lastpage :
67
Abstract :
Thermally stimulated currents (TSC) of ionomer/polyethylene blends were investigated. Experimental results obtained for aluminum, indium, lead, pressed gold, and evaporated gold electrodes are reported. The peak temperature and peak current observed for the high-temperature alpha peak was found to vary approximately linearly with the literature value of the work function of the metal. This is ascribed to differences in the ease of electron injection and its microscopic reverse. The lower temperature beta peaks showed differences with different electrode metals. Positive beta peaks were observed using lead electrodes whereas the gold electrodes always produced negative beta peaks. With aluminum electrodes, homopolymers showed negative beta peaks. Variables such as the partial oxidation of the metal and possible morphologic changes of the polymeric sample during the electrode evaporation were considered. After examining the effect on TSC of the various metal electrodes, evaporated gold was chosen as the best electrode for material TSC studies.<>
Keywords :
aluminium; gold; indium; lead; metal-insulator boundaries; thermally stimulated currents; work function; Al electrodes; Au electrodes; In electrodes; Pb electrodes; TSC; ease of electron injection; high-temperature alpha peak; homopolymers; ionomer/polyethylene blends; lower temperature beta peaks; metal/polymer contacts; microscopic reverse; negative beta peaks; partial oxidation; peak current; peak temperature; thermally stimulated currents; work function; Aluminum; Electrodes; Electron microscopy; Gold; Indium; Linear approximation; Oxidation; Polyethylene; Polymers; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 1988., Conference Record of the 1988 IEEE International Symposium on
Conference_Location :
Cambridge, MA, USA
ISSN :
1089-084X
Type :
conf
DOI :
10.1109/ELINSL.1988.13867
Filename :
13867
Link To Document :
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