Title :
Heat flux sensor modeling
Author :
Gridchin, Victor A. ; Lobach, Oleg V.
Author_Institution :
Novosibirsk State Tech. Univ., Novosibirsk, Russia
Abstract :
In this paper the silicon micromachined heat flux sensor is present. A thermal resistance of the sensor is defined by simple model and finite element model. Temperature distribution inside heat flux sensor is received. Modeling results is compared with experimental data.
Keywords :
elemental semiconductors; finite element analysis; micromechanical devices; semiconductor device models; silicon; temperature distribution; thermal resistance; thermal resistance measurement; thermopiles; Si; finite element model; heat flux sensor; micromachining; temperature distribution; thermal resistance; Biomembranes; Conductors; Mechanical sensors; Resistance heating; Sensor phenomena and characterization; Silicon; Temperature sensors; Thermal conductivity; Thermal resistance; Thermal sensors; Heat flux sensor; MEMS; micromachined technology; thermopile;
Conference_Titel :
Modern Problems of Nanoelectronics, Micro- and Nanosystem Technologies, 2009. INTERNANO 2009. International School and Seminar on
Conference_Location :
Novosibirsk
Print_ISBN :
978-1-4244-5534-8
DOI :
10.1109/INTERNANO.2009.5335630
