DocumentCode
2433517
Title
Process for the determination of thickness of polymeric microchannels for microfluidic applications
Author
Yunus, Nurul Amziah Md ; Jaafar, Haslina ; Green, Nicolas G.
Author_Institution
Dept. of Electr. & Electron. Eng., Univ. Putra Malaysia, Serdang, Malaysia
fYear
2011
fDate
28-30 Sept. 2011
Firstpage
344
Lastpage
348
Abstract
We have developed a technique of fabricating device channels for microfludics system by using high performance epoxy polymeric based dry film resists (DFRs). We will use the fabrication method originated in silicon microelectronics fabrication industry. This is because the interest in this industry has made the current microfluidic devices fabricated not only from silicon substrate but also to a range of polymers and glasses. Our observations are made on the effect of the thickness before and after curing and bonding mechanism of DFR on glass substrate. Therefore the thickness of the channels is recorded. The outcomes of the bonding procedure are captured. These channels are patterned and sandwiched in between two glass substrates. They can be used for handling continuous fluid flow and particle. In our advance, the channel was formed for dielectrophoretic (DEP) colloidal particle separation systems.
Keywords
elemental semiconductors; integrated circuit manufacture; integrated circuits; microfluidics; resists; silicon; Si; device channels fabrication; dielectrophoretic colloidal particle separation systems; epoxy polymeric based dry film resists; glasses; microelectronics fabrication industry; microfludics system; polymeric microchannels; polymers; thickness determination; Curing; Fabrication; Glass; Laminates; Microfluidics; Resists; Thickness measurement; Colloidal Particles; Dry Film Resist; Microfluidic; Separation; Thickness;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro and Nanoelectronics (RSM), 2011 IEEE Regional Symposium on
Conference_Location
Kota Kinabalu
Print_ISBN
978-1-61284-844-0
Type
conf
DOI
10.1109/RSM.2011.6088357
Filename
6088357
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