Title :
Development of light-trapped, interconnected, Silicon-Film modules
Author :
Ford, D.H. ; Rand, J.A. ; Barnett, A.M. ; DelleDonne, E.J. ; Ingram, A.E. ; Hall, R.B.
Author_Institution :
AstroPower Inc., Newark, DE, USA
fDate :
29 Sep-3 Oct 1997
Abstract :
AstroPower is employing Silicon-FilmTM technology toward the development of an advanced thin-silicon-based, photovoltaic module product. This module combines the design and process features of advanced thin-silicon solar cells, is light trapped, and integrated in a low-cost monolithic interconnected array. This advanced product includes the following features: (a) silicon layer grown on a low-cost substrate; (b) a nominally 50-micron thick silicon layer with minority carrier diffusion lengths exceeding 100 microns; (c) light trapping due to back-surface reflection; and (d) back surface passivation. The thin silicon layer achieves high solar cell performance and can lead to a module conversion efficiency as high as 19%. These performance design features, combined with low-cost manufacturing using relatively low-cost capital equipment, continuous processing and a low-cost substrate, will lead to high performance, low cost photovoltaic panels
Keywords :
carrier lifetime; elemental semiconductors; minority carriers; passivation; semiconductor device manufacture; semiconductor growth; semiconductor thin films; silicon; solar cell arrays; 12.5 percent; 19 percent; 50 micron; 9.79 percent; Si; Silicon-FilmTM technology; back surface passivation; back-surface reflection; continuous processing; light trapping; low-cost manufacturing; low-cost monolithic interconnected array; minority carrier diffusion length; module conversion efficiency; performance design features; photovoltaic panels; process features; Costs; Manufacturing processes; Optical arrays; Optical reflection; Passivation; Photovoltaic cells; Photovoltaic systems; Process design; Silicon; Solar power generation;
Conference_Titel :
Photovoltaic Specialists Conference, 1997., Conference Record of the Twenty-Sixth IEEE
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-3767-0
DOI :
10.1109/PVSC.1997.654168