DocumentCode
2433821
Title
Micro capacitive vacuum sensor based on MEMS
Author
Wang, Shaojie ; Feng, Yongjian
Author_Institution
Dept. of Mech. Electronically Eng., Xiamen Univ., Xiamen, China
fYear
2010
fDate
20-23 Jan. 2010
Firstpage
1160
Lastpage
1164
Abstract
In this paper, we describe the development process of the micro capacitive vacuum sensor Based on MEMS. The sensor mainly uses the p+ silicon etching automatically stops and anodic bonding technology, the formation of glass - silicon - glass sandwich structure. The micro-vacuum sensor with a simple structure, high sensitivity, its size is 5 mm × 6.4 mm. The vacuum sensor measuring range is 5 × 10 - 3 ~ 6 × 10 - 2 Pa, the linearity of 5.9%, sensitivity and relatively stable.
Keywords
capacitive sensors; etching; microsensors; pressure sensors; silicon; vacuum measurement; Jk-Si-Jk; MEMS; anodic bonding technology; glass-silicon-glass sandwich structure; micro capacitive vacuum sensor; silicon etching; size 5 mm; size 6.4 mm; Anodic bonding system; MEMS; Vacuum Sensor; p + silicon etching-stop;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location
Xiamen
Print_ISBN
978-1-4244-6543-9
Type
conf
DOI
10.1109/NEMS.2010.5592532
Filename
5592532
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