DocumentCode
2434240
Title
The current distribution and heat localization in the integrated circuits plating at the effect of electromagnetic fields
Author
Taran, Ye.P. ; Starostenko, V.V. ; Grygoriev, Ye.V. ; Lashennikov, D.E.
Author_Institution
Tavrical Nat. Univ., Ukraine
fYear
2000
fDate
11-15 Sept. 2000
Firstpage
478
Lastpage
479
Abstract
The numerical researches on investigation of current distribution nature in plating are conducted at the effect of electromagnetic fields. The mechanisms leading to microscopic degradation of plating and edge effects origin are detected.
Keywords
current distribution; electromagnetic fields; integrated circuit modelling; current distribution; edge effect; electromagnetic field; heat localization; integrated circuit plating; Current density; Current distribution; Degradation; Electromagnetic fields; Electromagnetic heating; IEEE catalog; Metallization; Microwave technology; Organizing; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2000. Microwave and Telecommunication Technology. 2000 10th International Crimean
Conference_Location
Crimea, Ukraine
Print_ISBN
966-572-048-1
Type
conf
DOI
10.1109/CRMICO.2000.1256190
Filename
1256190
Link To Document