A scalable thermal mechanical test chip for package characterization and qualifications

Author

Duffalo, Joseph M. ; Domer, Steven M. ; Hollstein, Roger L. ; Hullinger, Alan K. ; Niederkorn, Andrea J. ; Wecker, Nola J.

Author_Institution

Appl. Specific Integrated Circuits Div., Motorola Inc., Chandler, AZ, USA

fYear

1994

fDate

16-19 Oct 1994

Firstpage

42

Lastpage

49

Abstract

A thermal mechanical test chip (TMTC) has been designed to reduce the cycle time and cost of package reliability qualifications. The TMTC moves package reliability assessment closer to the package and assembly development cycle by breaking the tie between silicon qualification and package qualification. This approach comprehensively addresses both the mechanical and the thermal reliability issues of package assembly without the added design and manufacturing costs of a full flow silicon test chip

Keywords

integrated circuit packaging; integrated circuit reliability; integrated circuit testing; production testing; cycle time; mechanical reliability issues; package assembly; package characterization; package qualification; package reliability; reliability assessment; scalable thermal mechanical test chip; thermal reliability issues; Application specific integrated circuits; Assembly; Circuit testing; Costs; Integrated circuit packaging; Integrated circuit reliability; Qualifications; Silicon; Stress; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop, 1994. Final Report., 1994 International

Conference_Location

Lake Tahoe, CA

Print_ISBN

0-7803-1908-7

Type

conf

DOI

10.1109/IRWS.1994.515825

Filename

515825