DocumentCode
2434612
Title
A novel method for measuring thick film thermal conductivity
Author
Wei-Che Sun ; Mei-Jiau Huang ; Heng-Chieh Chien ; Tien-Yao Chang ; Da-Jeng Yao
Author_Institution
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2010
fDate
20-23 Jan. 2010
Firstpage
1052
Lastpage
1056
Abstract
We describe a novel method to measure the thermal conductivity of thick films. Based on the analytical solution of a comprehensive 2-D film-substrate heat diffusion problem, we derived a simple empirical solution for determination of the thick-film thermal conductivity. We use the negative photoresist SU-8 as a thick film material, the use of lithography process and a simple instrument that can be obtained from the measurement system, allowing measurements of SU-8 thick-film thermal conductivity coefficient of 0.21 W / mK. The results with the SU-8 record of the thermal conductivity coefficient (0.2 W / mK) is very similar. It is also establishes the feasibility of the measurement method.
Keywords
photoresists; thermal conductivity; thermal conductivity measurement; thick films; 2D film-substrate heat diffusion problem; negative photoresist; thick film thermal conductivity; Measurement; SU-8; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location
Xiamen
Print_ISBN
978-1-4244-6543-9
Type
conf
DOI
10.1109/NEMS.2010.5592572
Filename
5592572
Link To Document