مرکز منطقه ای اطلاع رساني علوم و فناوري - Thermal issues in microelectronics [breaker page]

DocumentCode :

2434751

Title :

Thermal issues in microelectronics [breaker page]

fYear :

2012

fDate :

24-26 May 2012

Firstpage :

295

Lastpage :

296

Abstract :

Start of the Thermal issues in microelectronics section.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference

Conference_Location :

Warsaw, Poland

Print_ISBN :

978-1-4577-2092-5

Type :

conf

Filename :

6226295

Link To Document :