A three-dimensional measurement system based on moiré interferometry for visual inspection of hemi-sphere objects

Author

Kim, Min Young

Author_Institution

Kohyoung Technol., Seoul

fYear

2007

fDate

17-20 Oct. 2007

Firstpage

2759

Lastpage

2762

Abstract

This paper focus on the measurement of hemi-sphere objects with specularity and shadow. For accurate measurement of these objects, a specially designed visual sensor system is proposed, which is based on phase shifting moire interferometry. To remove specular noise and shadow area efficiently, a compact multiple-pattern projection is implemented in the sensor system. To see how this system works, a series of experiments is performed and the results are analyzed in detail.

Keywords

automatic optical inspection; image sensors; integrated circuit packaging; phase shifting interferometry; hemi-sphere objects; multiple-pattern projection; phase shifting moire interferometry; semiconductor packaging inspection; three-dimensional measurement system; visual inspection; visual sensor system; Flip chip; Gratings; Inspection; Light sources; Optical interferometry; Semiconductor device noise; Semiconductor device packaging; Sensor systems; Shape measurement; Wafer scale integration; Bump inspection; Hemi-sphere; Moire; Semiconductor packaging inspection; Solder ball inspection;

fLanguage

English

Publisher

ieee

Conference_Titel

Control, Automation and Systems, 2007. ICCAS '07. International Conference on

Conference_Location

Seoul

Print_ISBN

978-89-950038-6-2

Electronic_ISBN

978-89-950038-6-2

Type

conf

DOI

10.1109/ICCAS.2007.4406837

Filename

4406837