Title :
An approach to produce a stack of photo definable polyimide based flat UTCPs
Author :
Priyabadini, Swarnakamal ; Sterken, Tom ; Wang, Lingfeng ; Dhaenens, K. ; Vandecasteele, B. ; van Put, Steven ; Petersen, A.E. ; Vanfleteren, Jan
Author_Institution :
CMST (Affiliated with IMEC and Universiteit Gent), Technologiepark 914a, B-9052 Gent, Belgium
Abstract :
Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location :
Amsterdam, Netherlands
Print_ISBN :
978-1-4673-4645-0
DOI :
10.1109/ESTC.2012.6542069
