• DocumentCode
    2434908
  • Title

    An approach to produce a stack of photo definable polyimide based flat UTCPs

  • Author

    Priyabadini, Swarnakamal ; Sterken, Tom ; Wang, Lingfeng ; Dhaenens, K. ; Vandecasteele, B. ; van Put, Steven ; Petersen, A.E. ; Vanfleteren, Jan

  • Author_Institution
    CMST (Affiliated with IMEC and Universiteit Gent), Technologiepark 914a, B-9052 Gent, Belgium
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542069
  • Filename
    6542069
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2434908