A study on optimization design of Ultrasonic Bonding Machine

Our life has many electronic products and its use getting increase sharply in the future. For this reason, importance of semiconductors packaging technology with small size, multi function has been a steady increase every day. So flip chip interconnection technology to satisfy the requirements is realized very important technology by many researchers and various study of the flip chip interconnection technologies such as process and technology of bonding, bumping and UBM process etc. are going on actively. The technology of bonding is classified into bonding process as thermo compression bonding, ultrasonic bonding and laser bonding. In this paper flip chip bonding machine using ultrasonic bonding process technology is developed. The bonding machine which can bond gold to gold and gold to aluminum using 40 kHz ultrasonic. The machine is semi auto ultrasonic flip chip bonding machine. It consists of three units: 1. Bonding head unit of accurate structure for reliability 2. Panel stage unit of accurate actuator structure for velocity and force control 3. Align Camera unit consist of 2 CCD camera module and mirror type for align of COG.